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Intel must feel the heat of Laptops powered by Qualcomm Snapdragonbecause the company is currently developing its first hybrid processor or system on chip (SOC).
Meet Lakefield, an Intel processor unlike anything you've seen beforebecause it contains more than one type of processor core to create a more complete chip. Plus, these hybrid chips can even come with their own built-in memory, their I / O interface, their wireless connectivity and, of course, their integrated graphics.
In this way, Lakefield works more like the ARM processor present in your computer. smartphone that the traditional computer processors that powered laptop and desktops practically since their invention. Lakefield could become the biggest game changer for computers in a very long time.
It is not surprising that Intel is not alone in pursuing the dream of SOC, AMD Ryzen 3rd generation Chips are also designed to be hybrid processors. Before this new wave of SOC arrives, here's all you need to know about Intel Lakefield.
Cut to the hunt
- What is it? Intel's first hybrid processors
- When did he go out? In 2019
- How much will it cost? To be determined
Intel Lakefield release date
Until now, Intel has only promised that Lakefield will be in production this year. However, Intel also said it will be resolved to install 10-nm devices on the tablets in time for the 2019 holiday shopping season in the United States. We can reasonably expect that products operating with Lakefield become available between October and December.
Intel Lakefield Award
The Lakefield processors pricing will be very difficult to pin down because, as we mentioned, these will be Intel's very first hybrid processors. Without pre-existing chips to use as a reference point, we do not really have much basics on which to base ourselves.
In addition, it seems that Lakefield will be primarily integrated with laptops and other types of mobile devices, rather than appearing on store shelves as boxed processors. With this in mind, these hybrid processors will likely only be available to business partners such as system integrators and OEMs. As a result, your chances of purchasing standalone Lakefield processors are slim.
Specifications of Intel Lakefield
Before going into the details of the composition of an Intel Lakefield processor, it is worth discussing the guiding principle or the technological revolution behind the company's first x86 hybrid processor: Foveros.
To begin this journey, we will first look at the past of Intel.
Most Intel processors used until now a monolithic or 2D integration package, that is to say the way chips are built. The old process was used for most Intel processors, in which the processor core, built-in memory, I / O and graphics are all integrated into a single chip or unit.
Intel recently introduced 2D integration with its Kaby Lake G processors, which place Intel processor cores with discrete class AMD graphics next to each other. Although the two separate components are ultimately integrated into a single package, they are connected through the use of the integrated multi-matrix interconnection bridge, which enables high-speed communication.
Foveros is essentially an evolution of this 2D integration, in which other components can be stacked on top of each other in a form of logic-based logical integration.
The influence of Foveros on the design of Intel's Lakefield processor can be easily seen through a recently released video which dissects the hybrid processor. We can clearly see that the 12 mm square package is stacked like a sandwich, with an integrated memory based on the main components of the chip.
The CPU itself includes a mix of different cores, including a 10-nm Sunny Cove core for performance and four smaller 10nm Atom cores for low-power tasks. This combination of processor cores operating differently will likely enable the reduced form factor peripherals to simultaneously deliver performance and energy efficiency.
In addition, this chip comes with Intel Gen11 integrated graphics, as well as interfaces for cameras and wired connections, or I / O, not to mention the built-in memory installed above all these components.
Despite their superimposed nature, Intel Lakefield processors will always fit into the smallest device. To his CES 2019 keynote, Intel showed how its hybrid processor can be mounted on a motherboard not exceeding one Roku Streaming Stick.
Intel said Lakefield could scale from energy-efficient systems to machines offering the optimal performance of a PC. This wide range of devices includes traditional laptops, 2-in-1 laptops (convertible or removable) and even dual-screen laptops. Devices similar to Intel Tiger Rapids and Asus Precog Project could get this new hybrid processor.
That's all we know about Intel Lakefield so far, but we're sure to learn more about Intel's innovative hybrid processor. Stay tuned on this page, because we will present the latest developments as we know.
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