AMD Announces New Generation Leadership Products at Computex 2019 Nasdaq Main Conference: AMD

– 3^rd Gen AMD Ryzen ™ Desktop Processor Family Based on the New "Zen 2" High-Performance Core Featuring 12-Core Desktop Processor with Unmatched Performance¹ –

– New RDNA gaming architecture and next-generation AMD Radeon ™ RX 5700 Series graphics will accelerate the future of PC, console and cloud games –

– First PCIe in the world^® PC 4.0 platform compatible with the greatest ecosystem availability of the AMD story scheduled for July 2019 –

SANTA CLARA, California, May 26, 2019 (GLOBE NEWSWIRE) – AMD (NASDAQ: AMD) has once again marked the history of technology with the announcement of 7nm high-performance graphics and computing products that are expected to deliver new levels of performance, functionality and experience to players, enthusiasts and creators of PC content. In the first ever Computex opening speech, Dr. Lisa Su, President and CEO of AMD, announced:

• The new "Zen 2" core far surpasses the industry's historic trend of improving generational performance: up to 15% of estimated clock-based instructions (IPC)² uprising on the architecture predecessor "Zen". The core of the "Zen 2" processor that powers the next-generation AMD Ryzen and EPYC ™ processors also includes significant design improvements, including cache sizes and the redefined floating-point engine.
• The 3^rd The Gen AMD Ryzen family of desktop processors, including the new 9-core 12-core Ryzen processor, offers leading performance.¹
• The AMD X570 chipset for AM4 socket, the world's first PCIe 4.0 compatible chipset with more than 50 new motherboards at launch.
• The RDNA gaming architecture designed to drive the future of PC games, console and cloud is expected to deliver incredible performance, power, and memory efficiency in a smaller enclosure.
• AMD Radeon RX 5700 Series 700 series graphics cards offer high-speed GDDR6 memory and support for PCIe 4.0 interface.

Dr. Su was joined by Roanne Sones, vice president of the Microsoft operating platform at Microsoft, Joe Hsieh, chief operating officer of Asus, co-chief operating officer of Acer, Jerry Kao, as well as many other important players in the industry. AMD computer ecosystem and high performance graphics.

"2019 marks an incredible start for AMD, which celebrates 50 years of innovation by offering cutting-edge products to push the boundaries of what it's possible to do with computer and graphic technology," said the Dr. Su. "We have made significant strategic investments in next-generation cores, a revolutionary design approach and advanced process technologies to deliver advanced 7-nm products to our high-performance computing ecosystem." We are extremely pleased to launch Computex 2019 in collaboration with our industry partners as we prepare to market our next generation of Ryzen EPYC desktop and server processors and Radeon RX gaming graphics cards. "

AMD High Performance Office Updates

Continuing its momentum as a leader in the PC market and as a leader in the industry, AMD announced the 3^rd Gen AMD Ryzen Desktop Processor, the Most Advanced Desktop Processor in the World³ with breakthrough performance in gaming, productivity, and content creation applications. Based on the new "Zen 2" architecture with the AMD chiplet design approach, 3^rd Gen AMD Ryzen desktop processors should offer extremely critical disk cache in terms of performance, in order to release the game's elite performance. In addition, the 3^rd Gen Ryzen desktop processors benefit from the world's first PCIe 4.0 PC availability in the world for the most advanced motherboard, graphics and storage technologies, setting a new standard for performance and delivering the ultimate user experience.

With the 3^rd AMD Ryzen family of desktop processors, AMD has launched a new class of Ryzen 9 desktop processors with the flagship product Ryzen 9 3900X with 12 cores / 24 wires. Push the limits of the high performance of the AM4 socket by offering leadership performance¹, the family ends with 8 basic models Ryzen 7 and 6 basic models Ryzen 5.

During the conference, Dr. Su presented various live demonstrations highlighting the leadership performance of the 3^rd Gen Ryzen desktop processors compared to competing production parts:

• Ryzen ™ 7 3700X vs i7-9700K with real-time rendering: The Ryzen 7 3700X offered 1% more single-threaded, and 30% more multi-threaded performance.⁴
• Ryzen ™ 7 3800X vs. i9-9900K with PlayerUnknown Battleground Game: The Ryzen 7 3800X equaled the performance of the i9-9900K.⁵
• Ryzen ™ 9 3900X vs i9-9920X with Blender Render: The Ryzen 9 3900X beat the Intel i9 9920X by more than 16%.⁶

3^rd Gen AMD Ryzen Desktop Processor Series and Availability

Model	Cores / The sons	TDP7 (Watts)	Boost / Base Frequency (GHz)	Total cache (MB)	PCIe 4.0 Channels (processor + AMD X570)	Sep8 (USD)		Expected availability
Ryzen ™ 9 3900X CPU	12/24	105W	4.6 / 3.8	70	40	$	499	July 7, 2019
Ryzen ™ 7 3800X CPU	8/16	105W	4.5 / 3.9	36	40	$	399	July 7, 2019
Ryzen ™ 7 3700X CPU	8/16	65W	4.4 / 3.6	36	40	$	329	July 7, 2019
Ryzen ™ 5 CPU 3600X	6/12	95W	4.4 / 3.8	35	40	$	249	July 7, 2019
Ryzen ™ 5 3600 CPU	6/12	65W	4.2 / 3.6	35	40	$	199	July 7, 2019

AMD has also introduced a new X570 chipset for AM4 socket, supporting the world's first PCIe 4.0 preparation system, which has 42% faster storage performance than PCIe 3.0.⁹, allowing the creation of high performance graphics cards, network devices, NVMe players, etc. With PCIe 4.0 that doubles the motherboard bandwidth with the X570 chipset compared to PCIe 3.0, PC enthusiasts can gain in performance and flexibility when building custom systems. X570 Delivers Largest Availability of Ecosystem in AMD's History, With Over 50 New Expected Motherboard Models from ASRock, Asus, Colorful, Gigabyte, MSI, and Partner PCIe 4.0 Storage Solutions such as Galaxy, Gigabyte and Phison. The 3^rd The Gen AMD Ryzen desktop processors should be available for purchase worldwide on July 7, 2019.

In addition, leading OEMs and system integrators, such as Acer, Asus, CyberPowerPC, HP, Lenovo, and MAINGEAR, have strengthened ecosystem support for new platforms by announcing their intention to expand their network. offer 3^rd The gaming desktop systems based Gen AMD Ryzen over the next few months.

AMD High Performance Game Updates

AMD unveiled RDNA, the next fundamental gaming architecture designed to ensure the future of PC games, console and cloud for years to come. With a new calculation unit^ten RDNA should deliver incredible performance, power, and memory efficiency in a smaller package compared to the previous generation of GCN (Graphics Core Next) architecture. It should provide up to 1.25 times more performance per clock¹¹ and up to 1.5 times more efficient per watt than the GCN¹², allowing better gaming performance with reduced power consumption and latency.

RDNA will power the next 7 nm AMD Radeon RX 5700 graphics cards with high-speed GDDR6 memory and PCIe 4.0 interface support.

In his speech, Dr. Su presented the power of the RDNA and one of the new AMD Radeon RX 5700 graphics cards in a front-end comparison with a RTX 2070 card running a Strange Brigade gameplay demo, beating the competition ~ 100 FPS game¹³

The AMD Radeon RX 5700 series graphics cards are expected to be available in July 2019. Learn more during the AMD E3 live event on June 10, 2019 at 3 pm EST.

AMD Data Center Updates

AMD Data Center Industry continues to gain traction with customers, gaining application workloads from the world's largest cloud environments exascale supercomputer, and capitalizing on the huge potential market for AMD EPYC and AMD Radeon Instinct ™ processors.

During his speech, Mr. Su continued his anticipation work on the next generation AMD EPYC processors with the first public demonstration of a^{North Dakota} Gen AMD EPYC server platform. The demonstration showed a 2P 2^{North Dakota} Gen AMD EPYC server compared to an Intel Xeon 2P^® Server based on 8280 running a test evaluation of NAMD Apo1 v2.12. Preproduction 2^{North Dakota} The Gen AMD EPYC processor-powered server outperformed servers powered by Intel Xeon by more than twice the NAMD benchmark.¹⁴

Finally, Microsoft Azure ad achieving previously unrealistic performance levels for digital fluid dynamics with the help of an Azure HB cloud instance running on a 1^st System based on EPYC Gen AMD processor. Taking advantage of AMD EPYC's exceptional memory bandwidth, Azure HB has extended the Siemens Star -CCM + application to more than 11,500 cores using a 100 million-pixel simulation. Le Mans cells, far beyond the goal of 10,000 hearts never reached before. "HB Series virtual machines on Azure are changing the game for HPC in the cloud. For the first time, HPC customers can scale their MPI workloads to tens of thousands of cores with cloud agility, performance, and economic performance that rivals on-premise clusters, "said Navneet Joneja, product manager at Azure Virtual Machines, Microsoft Corp "We are excited to see this new Azure offering do great things for HPC-based innovation and productivity."

Both^{North Dakota} The Gen AMD EPYC processor family is expected to deliver up to twice as much performance per socket¹⁵ and up to 4 times the floating performance per socket¹⁶ on the previous generation.

Both^{North Dakota} The AM AMD EPYC server processor family is expected to launch in the third quarter of 2019.

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About AMD

For 50 years, AMD has been driving innovation in high-performance computing, graphics and visualization technologies, which are the building blocks of games, immersive platforms and the data center. Hundreds of millions of consumers, leading Fortune 500 companies and leading scientific research facilities around the world rely on AMD technology on a daily basis to enhance their lives, work and play. AMD employees around the world are focused on creating superior products that push the boundaries of what is possible. For more information on how AMD today helps and inspires tomorrow, visit the AMD website (NASDAQ: AMD). website, blog, Facebook and Twitter pages.

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This press release contains forward-looking statements regarding Advanced Micro Devices, Inc. (AMD), including the features, functionality, availability, timing, deployment, and expectations of AMD's future products, including 3.^rd Gen AMD Ryzen Desktop Processors, AMD Radeon RX 5700 Series 7 nm and 2 Series Graphics Cards^{North Dakota} The Gen AMD EPYC Server Processor family, which is designed in accordance with the provisions of Safe Harbor's Safe Securities Content Act, are commonly identified by words such as "would like", "intends", "believes", "expects", "may", "will", "should", "seeks", "intends", "plans", "pro forma", "estimates", "anticipates", or the negative of these words or expressions, other variations of these words and phrases or comparable terminology. 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AMD, the AMD Arrow logo, EPYC, Ryzen, Radeon and their combinations are trademarks of Advanced Micro Devices, Inc. Other names are for informational purposes only and may be trademarks of their respective owners .

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_{¹ Tests performed by AMD Performance Labs as of 26/05/2019 with the Ryzen 9 3900X compared to the Core i9-9920X on Cinebench R20 nT. The results may vary. RZ3-13}

_{² Tests performed by AMD Performance Labs on 23/05/1918 The AMD "Zen2" processor system scored an estimated 15% higher than the previous generation of AMD's "Zen" processor system, using the estimated results of SPECint®_rate_base2006. SPEC and SPECint are registered trademarks of Standard Performance Evaluation Corporation. See www.spec.org. GD-141}

_{³ "Advanced" defined as superior process technology in a smaller node and unique support for PCIe® Gen 4 in the video game market as of 26/05/2019. RZ3-14}

_{⁴ Tests performed by AMD Performance Labs as of 26/05/2019 with the Ryzen 7 3700X compared to the Core i7-9700K on Cinebench R20 1T and nT. The results may vary. RZ3-15}

_{⁵ Tests performed by AMD Performance Labs as of 26/05/2019 with the Ryzen 7 3800X and Core i9-9900K in PUBG. The results may vary. RZ3-16}

_{⁶ Tests performed by AMD Performance Labs as of 26/05/2019 with the Ryzen 9 3900X compared to the Core i9-9920X on Cinebench R20 nT. The results may vary. RZ3-17}

_{⁷ Although both are often measured in watts, it is important to distinguish between thermal and electrical watts. The thermal power of the processors is transmitted via the rated thermal power (TDP). The TDP is a calculated value that reflects an appropriate thermal solution to ensure the desired operation of the processor. Electric watts are not a variable in the calculation of the TDP. By design, the electric watts can vary from one workload to another and can exceed the thermal watts. GD-109}

_{⁸ Suggest the price of the online retailer in US dollars from 23/05/2019.}

_{⁹ Tests performed on 05/20/2019 by AMD Performance Labs using a third-generation AMD Ryzen ™ processor in Crystal DiskMark 6.0.2. The results may vary with the configuration. RZ3-12}

_{^ten APUs and AMD GPUs based on Graphics Core Next and RDNA architectures contain GPU cores consisting of compute units, defined as 64 shaders (or flow processors) working together. GD-142}

_{¹¹ Tests performed by AMD performance labs on 23/05/19, showing a 1.25 times per hour geomean on 30 different games with 4K Ultra, 4xAA parameters. Performance may vary depending on the use of the latest drivers. RX-327}

_{¹² Tests performed by AMD performance labs on 23/05/19, using the parameters Division 2 @ 25×14 Ultra. Performance may vary depending on the use of the latest drivers. RX-325}

_{¹³ Tests performed by AMD Performance Labs on 05/23/19, using parameters Strange Brigade @ 25×14 Ultra. Performance may vary depending on the use of the latest drivers. RX-328}

_{¹⁴ The 7nm preproduction of 2nd generation EPYC ™ powered processors in a 2P server configuration outperformed the Intel 2 Xeon 8280 2P powered server by an average of up to 2X over the NAMD benchmark. Internal tests performed by AMD on May 21, 2019. Silicon production results may vary. ROM-05}

_{¹⁵ Tests performed by AMD Engineering as of October 2018 using the AMD reference system with a sample of pre-production engineering "Rome", where "Rome" scored twice as high by compared to the system "Naples". Actual results with production silicon may vary. ROM-03}

_{¹⁶ Estimated generational increase based on AMD internal design specifications for "Zen 2" versus "Zen 1". "Zen 2" has 2 times the core density of "Zen 1" and, multiplied by 2 times the maximum number of FLOP per heart, at the same frequency, the flow rate is 4 times higher. Actual results with production silicon may vary. ROM-04}

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