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On the occasion of AMD's speech at Computex 2019, Dr. Lisa Su, CEO of AMD, unveiled the details of the new X570 chipset designed for future "Matisse" processors of the series Ryzen 3000. The next generation of third-generation AM4 motherboards include PCIe 4.0 support, native USB 3.1 Gen2 ports, and slightly more power-hungry TDP, which means motherboard manufacturers must use heat sinks chipset actively cooled.
The new X570 chipset is the first mainstream motherboard chipset to incorporate the default PCIe 4.0 standard. We found that manufacturers were preparing previous-generation X470 / B450 motherboards to offer limited support for PCIe 4.0 through a wave of firmware updates, taking advantage of the processor-independent PCIe controller. However, due to some requirements The cards from the previous generation will only have the full superior slot running PCIe 4.0 when paired with a Ryzen 3000 series processor. The limitations are due to the length of traces required by the 39, PCIe 4.0 interface. This means that traces of more than a few centimeters will not be able to use PCIe 4.0 if they are not equipped with redistributors to push the signal further into the map.
The MSI MEG X570 Godlike motherboard
With the new X570 cards, the implementation of PCIe 4.0 was thought from the start, with motherboards optimized for the interface, most models probably including redrivers on the more remote slots. When we link a Ryzen 3000 series processor to a typical X570 motherboard, we will see that the channels that enter the upper PCIe slot come directly from the processor, as well as the four PCIe channels allocated to the first NVMe M. 2 slot. This means that the X570 chipset – which also supports PCIe 4.0, but is not a requirement for processor-hosted channels to use PCIe 4.0 – can use its own channels for USB 3.1 Gen2 capability. Not only that, but it also allows the chipset to handle Wi-Fi, Bluetooth and SATA responsibilities.
One of the disadvantages of a more powerful chipset is that it consumes about 11 W of power; for comparison purposes, the X470 chipset used approximately 6 W of power to operate. (This is different from the reported 15W – it seems that AMD manufactures two variants of the chipset, the 11W on consumer cards and the 15W for the company, the 15W having more PCIe lanes.)
Another change in the way that AMD is developing its chipsets is that everything is now done internally, licensed under IP ASMedia and others, instead of completely outsourcing its chip design to ASMedia as with X470 and X370. The main reasons for the increase in the TDP are due to PCIe 4.0. For AMD partners, we expect a series of quick and comprehensive updates to add additional power management capabilities to the chipset between now and the launch of the processor.
We are still waiting for a full disclosure of the chart by AMD and, when we do, we will update this news.
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