Galaxy Z Flip 3’s first benchmark confirms its most important specs

With less than a month to go before the unveiling of the new foldable smartphones, Samsung fans are understandably excited about what Samsung has in store for them. While we’ve seen most of the leaks already, there’s always room for more.

The very first Galaxy Z Flip 3 benchmark has now appeared online. It confirms some of the most important specs of Samsung’s upcoming foldable clamshell.

The first Galaxy Z Flip 3 benchmark confirms the important points

This is the Galaxy Z Flip 3’s first appearance on Geekbench, specifically the SM-F711U model, which will be heading to North America. The reference list confirms which chipset the device will run and how much RAM will be available on the base model.

Do you see Lahaina on the list ? This is the code name for the Qualcomm Snapdragon 888 chipset that will ship with all American variants of the foldable smartphone. It also shows that at least 8 GB of RAM will be offered with the device.

This means that customers can expect flagship-level performance from the new foldable smartphone. This will only make it more attractive at its reduced price.

The Galaxy Z Flip 3 will be unveiled at Samsung’s upcoming Unpacked event which will likely take place on August 11. The Galaxy Z Fold 3 will also launch on this day. Samsung’s other foldable has also appeared on Geekbench. Its listing revealed the Snapdragon 888 chipset in addition to 12 GB of RAM.

Samsung has obviously not yet confirmed the release date of its new foldable smartphones. There is reason to believe now that August 27 is the date when these devices will hit the shelves. August 27th can’t come soon enough!