3ders.org – SFU researchers use cellulosic material to 3D print wireless IoT sensors



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February 19, 2019 | By Thomas

Woo Soo Kim, professor of mechatronics systems at Simon Fraser University, and Swiss researchers are developing a print-friendly, 3D-friendly solution for the production of wireless sensors for Internet-of-Things (IoT). The research team is using a wood-based cellulosic material to replace the plastics and polymeric materials currently used in electronics. The solution could be used and disposed of without contaminating the environment. In addition, 3D printing has also enabled them to add or integrate functions on 3D shapes or textiles, creating increased functionality. Their research was published in the February issue of the journal Advanced electronic equipment.

Credit: SFU

"Our environmentally friendly 3D printed cellulose sensors can transmit wireless data over the course of their life, and can be disposed of without the risk of environmental contamination," said Kim, head of the company. 39, team, professor at the School of Mechatronic Systems Engineering Surrey campus at SFU. Research is underway at Surrey's PowerTech lab, which hosts several state-of-the-art 3D printers used to advance research.

"This development will help advance green electronics – for example, PCB waste is a source of environmental contamination." If we can turn PCB plastics into cellulosic composite materials, Recycling metal components board could be collected in a much easier way. "

Credit: SFU

Kim is also collaborating with a team of South Korean researchers from the Department of Robotics Engineering of the Daegu Gyeongbuk Institute of Science and Technology (DGIST), and with PROTEM Co Inc, a technology-based company, to the development of printable conductive ink materials.

In this second project, researchers have developed a new advance in the technology of the embossing process. This allows them to freely print thin circuit patterns on a flexible polymer substrate, a necessary component of electronic products.

Embossing technology is applied for mbad printing of precise patterns at a low unit cost. However, Kim claims that only pre-printed circuit patterns on the pattern pad can be printed, and that the complete and expensive buffer must be modified to incorporate different patterns.

The team has succeeded in developing a precise location control system that can directly print patterns, creating a new processing technology. This will have extended implications for use in semiconductor processes, wearable devices and the display industry.

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