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Before the announcement, Xiaomi has already released a number of product images on its next model, the Mi 9. The images show the entire phone from behind as well as some parts of the front. According to Xiaomi, the chin under the panel is 40% smaller than in the predecessor.
The image displayed on the home page also reveals that the fingerprint reader has been integrated under the screen. Hope that it is an ultrasonic drive and not an optical equivalent.
Press images indicate that the Mi 9 has three rear cameras and that the manufacturer will sell a net shell on the phone. Xiaomi also confirmed that the device was equipped with Qualcomm's latest 855 Snapdragon component, not surprisingly, but one of the cameras should also be able to reach 48MP.
Xiaomi Mi 9 is introduced jointly with MWC at the end of the month.
In August 2017, we established our first research and development center in the United States and quickly began to establish a close partnership with @Qualcomm.
We are now ready to usher in a new era of mobile technology at launch # MI9 with the Qualcomm Snapdragon 855 processor.
Are you ready? pic.twitter.com/hKud0d6p5E
– Wang Xiang (@XiangW_) February 15, 2019
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