[ad_1]
This "Comet Lake" slide from Intel is fake
Last week, Intel released a "Processor Details" slide, which included the promise of a host of new Comet Lake processors, a high number of cores, competitive pricing, and more. high frequencies. Although Intel Corporation does not comment on the rumors, we talked to sources close to the subject and confirmed that this slide is not made by Intel and is a fake slide. At the moment, it is probably better to know that, yes, new processors will come out, but we do not know the specifications for the moment. Similar to the rumors of Ryzen 5GHz processors for Zen2, it's probably best to ignore them until we're close enough to launch the system, so leaks from the board partners are more realistic than the invented slides.
Source: GN
Intel's new interconnection and packaging
While the monolithic chip approach for chip construction is becoming more and more complex and limited by physics, AMD and Intel have taken a smart approach. In Semicon West, Intel has solved the problem of new packaging and interconnect technologies that the chip maker says will bring chip design into the future.
Intel's new packaging technology, called Co-EMIB, essentially combines EMIB (Embedded Multi-Die Interconnect) and Foveros. If you remember, Intel debuted with EMIB in 2017 when it announced a partnership with AMD to bring Intel processors with Radeon graphics cards to market. This partnership culminated in the Kaby Lake G chip with Radeon Vega graphics, which powered the NUC Hades Canyon that we tested and overclocked intensively.
Foveros is relatively new, however, was only announced last year. Foveros is a 3D chip stacking technology that gives what Intel calls x86 hybrid processors. Fleas using Foveros should make their appearance in the Intel 10nm Lakefield range. By using both Foveros and EMIB, where Co-EMIB, Intel can link "even more performance and computing capabilities". In addition to connecting multiple Foveros elements, designers can also link other "tiles" (see: chiplets). such as analog components or memory.
Then there is the new omnidirectional interconnection (ODI). ODI is a communication framework that combines the horizontal communication of EMIB and the vertical communication of Foveros. ODI uses large silicon crossings (TVS) to communicate and deliver energy vertically across the base matrix. Larger TVs offer less resistance and facilitate wider bandwidth. This approach also means that Intel can use fewer TVs, thus optimizing disk space.
Finally, Intel introduced a new die-to-die interface, called MDIO. MDIO is rather a modular system consisting of a library of intellectual property blocks and is based on a PHY level interconnection of the Intel Advanced Interface Bus (AIB).
Source: https://newsroom.intel.com/news/intel-unveils-new-tools-advanced-chip-packaging-toolbox/#gs.o0fdri
Intel hires a former VMWare manager for communications
Intel hired Claire Dixon as vice president of the company and director of communications. Dixon's new role at Intel came into effect on July 1. It will be reported to Michelle Johnston Holthaus, Senior Vice President and General Manager, Intel Sales and Marketing Group and Acting Marketing Director, Intel. Dixon will be responsible for overseeing Intel's global communications organization, including communications and corporate events, product public relations, employee communications and analyst relations.
Dixon previously worked for VMWare, where she was Senior Vice President and Director of Communications. Previously, Dixon was vice president of global communications at eBay.
Source: https://newsroom.intel.com/news-releases/intel-appoints-claire-dixon-corporate-vice-president-chief-communications-officer/#gs.oc45mp
Threadripper of Ryzen 2000 and 2nd generation: price reductions
Since the launch of the AMD Ryzen 3000, the prices of Ryzen 2000 chips of the last generation have dropped considerably. Currently, the Ryzen 5 2600X costs 160 USD at Amazon, a fairly heavy discount from its suggested retail price of 260 USD. Meanwhile, the Ryzen 5 2600 costs $ 140, about $ 60 less than its $ 200 introductory price. Finally, the flagship product Ryzen 7 2700X has been reduced to $ 249, while it was launched at a price of $ 330.
The second generation of AMD's Threadripper is also undergoing its own price cuts. With the Ryzen 9 3900X encroaching on the last rung of the Threadripper 2000 product stack, it makes sense for AMD to lower the prices of the Threadripper 2950X and Threadripper 2920X. When the Ryzen 9 3950X debuts in September, these price cuts will make even more sense, because the chip will undoubtedly cannibalize more Threadripper last generation.
The Threadripper 2950X is currently priced at $ 730, just south of its $ 899 introductory price. The AMD Threadripper 2920X costs $ 340 at B & H. The 2920X debuted at $ 649.
Source: https://www.tomshardware.com/news/amd-ryzen-5-2600x-ryzen-7-2700x-amazon-deal,39812.html
https://www.tomshardware.com/news/amd-ryzen-threadripper-2-cpu-sale-deal,39810.html
Galax SSD PCIe 4.0 with 500GB option
Some PCIe 4.0 SSDs are already on the market, all based on the Phion PS5016-E16 controller. Until now, we know the models of Gigabyte, Corsair and Sabrent. Now, Galax is ready to enter the still unencumbered PCIe 4.0 arena. Like the older SSDs based on the new PCIe 4.0 standard, Galax's new HOF Pro will use the Toshiba's Phison PS5016-E16 controller and 96-layer 3D processor. TLC NAND.
The HOF Pro Galax will be based on the 2280 M.2 form factor and will be passively cooled with an aluminum heat sink. The Galax HOF Pro differentiates itself by offering a 500GB capacity option. Sequential read / write speeds vary by model, but the 2TB offer exceeds 5GB / s in read and 4, 4GB / s write, which complies with the paper specifications we observed on other PCIe 4.0 SSDs.
Although the price is not known, readers are expected to reach the retail chains by the end of the month.
Source: https://www.tomshardware.com/news/galax-hof-pro-m.2-pcie-4.0-ssd.39826.html
Samsung's 5nm LP node, based on an EUV, is progressing
Samsung has recently confirmed that its foundry has certified full stream tools from Cadence and Synopsys. The new tools will be used for chip design based on Samsung's 5nm 5LPE (Low Power Early) node. Samsung has certified both the Cadence Full-Flow Digital Solution full-flow design tools and the Synopsys Fusion design platform using the Arm Cortex-A53 and Arm Cortex-A57 cores.
"As part of our long-standing collaboration with Cadence, we have confirmed that its full digital workflow meets and exceeds the requirements of 5LPE process technology," said Jung Yun Choi, Vice President of the Technology Team at 5LPE. Samsung Electronics design.
Choi also commented on Samsung's collaboration with Synopsys. "Synopsys continues to be our preferred supplier for collaboration on the development and activation of new nodes, so that our founding customers can confidently adapt their designs to volume production across all segments of the market. market, including automotive, AI, high performance computing and mobile. "
According to Anandtech, newly certified tools include compilers, validators, power circuit optimizers and EUV-specific tools.
Source: https://www.anandtech.com/show/14620/samsungs-5nm-euv-technology-gets-closer-tools-by-cadence-synopsys-certified
https://finance.yahoo.com/news/cadence-digital-full-flow-achieves-043000409.html
https://news.synopsys.com/2019-06-04-Synopsys-Fusion-Design-Platform-First-to-be-Certified-by-Samsung-Foundry-for-5LPE-Process-with-EUV-Technology
Custom Navi Maps coming in mid-August
In our article on the AMD Radeon RX 5700 XT test, we mainly worried about faulty drivers and faulty thermals. The first will be (eventually) set by AMD, and the second will be the partners of AIB. AMD's Navi graphics processors suffer from the inadequacy and over-commonality of the cooler. It goes without saying that AIB partners have the opportunity to innovate with customized cooling solutions.
According to Scott Herkelman, vice president and general manager of Radeon, custom Navi cards will only be available in mid-August. "Hey all, custom AIB designs will hit the market in mid-August," Herkelman said via a Reddit feed. Herkelman also offered some justifications for the fan cooler.
"The Radeon Group has always had a bad reputation for producing product launch boards that did not match actual performance. What we like or hate, the fan has allowed us to guarantee performance in each system corresponding to our launch tables. Not everyone cools his PC as well as a reviewer and certainly not as good as some of the pictures you shared. My goal was to clean this up so you could trust the performance we heard on stage.
You can also see how we repaired the RX 5700 XT cooler.
Source: Scott Herkelman, Vice President and General Manager of Radeon,
via Reddit – https://www.reddit.com/r/Amd/comments/catck3/psa_5700_series_custom_aib_designs/?utm_source=share&utm_medium=ios_app
MSI Updates AM4 400 Series Cards with 32 MB BIOS Chips
With AMD's growing family of processors, upstream compatibility on AM4 socket cards is becoming a challenge for some motherboard vendors. In particular, MSI had problems with the 16 MB BIOS chips on the 300 and 400 series motherboards. To solve this problem, MSI restarts the AM4 400 series cards with 32 MB chips to better support the updates and microcode storage.
The "Max" identifier is associated with the new cards, as indicated by the Polish sites PurePC and Tom's Hardware.
A320:
B450
- B450M-A Pro Max
- B450M Pro-VDH Max
- B450 Gaming Plus Max
- B450M Pro-M2 Max
- B450M Mortar Max
- B450 Tomahawk Max
- B450-A Pro Max
x470
- X470 Gaming Pro Max
- X470 Gaming Plus Max
It is unclear whether other models will have larger BIOS chips or whether MSI will upgrade the BIOS chips of the 300 series cards.
Source: https://www.tomshardware.com/news/msi-amd-400-motherboards-ryzen-3000,39836.html
https://www.purepc.pl/felietony/msi_partner_convention_poznajemy_tajniki_plyt_glownych_x570
Editorial: Eric Hamilton
Video: Keegan Gallick
Moderator: Steve Burke
[ad_2]
Source link