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Ramallah – National Home
Telefonica, a global leader in mobile communications, and SIA Microelectronics, a leading wireless technology company, tested high-speed 10 Gbps wireless connections to improve connectivity for the next generation of 5G technology ,.
Point-to-point waveforms, operating at 80 GHz on the high frequency E band, offer the lowest latency during transport and the highest transmission capacity of 10 Gigabits per second on a single channel, thus meeting the strict requirements of the V5 G technologies. "Telefonica has completed a field trial of the SIA Microelectronics wireless solution for the use of 10 Gigabit point-to-point connections for civil applications and badembly. Multi-operator communications for suburban applications, providing high capacity connectivity at longer distances.
"SIA Microelectronics and Telefonica have collaborated on a number of projects to address the needs of fifth-generation networks," said Luigi Lovati, SIA Microelectronics Global Sales Director, Telefonica. From SDSN software applications in microfluidic waves to the introduction of high-speed wireless communications, this collaboration is once again a major step towards success. "
"Micronica has exceeded our expectations for high connectivity, stability and low-latency microwave communications," said Maria Antonia Crespo, Director of VoIP and Telephony Development at Telefonica, Spain . At Telefonica in Spain, Alberto Carrasco, using the "Plus Plus 80 HDX" platform with high frequency waves and a set well suited to 5G VLANs for short and medium range communications in situations where fiber optics are not available. is not available. "
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