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Today, Qualcomm is announcing the successor to last year’s highly successful Snapdragon 765 line, a ‘premium’ tier the company launched, with the same high-end features as on the flagship Snapdragon 800 series, albeit at lower performance.
The new Snapdragon 780G follows on from its predecessor with a few significant upgrades in performance and multimedia capabilities, doubling the number of large cores – dramatically increasing GPU performance and featuring the new, better-performing, fused AI engine. with the new Hexagon 770. DSP. In addition, the camera’s capture capabilities have also been significantly improved with the new triple ISP Spectra 570.
| Qualcomm Snapdragon Premium SoC | ||||
| SoC | Snapdragon 765 Snapdragon 765G |
Snapdragon 768G |
Snapdragon 780G |
|
| CPU | 1x Cortex-A76 At 2.3 GHz (non-G) At 2.4 GHz (765G) 1x Cortex-A76 6x Cortex-A55 |
1x Cortex-A76 At 2.8 GHz 1x Cortex-A76 6x Cortex-A55 |
1x Cortex-A78 At 2.4 GHz 3x Cortex-A78 4x Cortex-A55 |
|
| GPU | Adreno 620 | Adreno 620
+ 15% perf on 765G |
Adreno 642
+ 50% perf on 768G |
|
| DSP / NPU | Hexagon 696 HVX + tensor 5.4 TOPS AI |
Hexagon 770 Scalar + Tensor + Vector 12TOPs AI |
||
| Memory Controller |
2x 16-bit channel
At 2133 MHz LPDDR4X / 17.0 Gb / s |
|||
| ISP / Camera | Dual ISP Spectra 355 14-bit
1 x 192 MP |
FSI Spectra 570 triple 14 bit
1 x 192 MP |
||
| Encode/ Decode |
2160p30, 1080p120 H.264 and H.265 10-bit HDR pipelines |
|||
| Integrated modem | Snapdragon X52 Integrated (Category LTE 24/22) (5G NR Sub-6 4×4 100 MHz |
Snapdragon X53 integrated
(Category LTE 24/22) (5G NR Sub-6 4×4 100 MHz) |
||
| Mfc. Treat | Samsung 7 nm (7LPP) |
Samsung 5 nm (5 LPE) |
||
Basically, the new Snapdragon 780G is a very different SoC from its predecessor because it significantly changes the configuration of the processor. We are moving from a 1 + 1 + 6 configuration to a new 1 + 3 + 4 configuration, comprising one main Cortex-A78 core at 2.4 GHz, three Cortex-A78 cores at 2.2 GHz and four Cortex-A55 cores. at 1.9 GHz. Qualcomm promises processor increases of up to 40% – the doubling of large cores as well as the new microarchitecture employed should indeed offer a good boost to the daily user experience.
On the GPU side, we see the use of a new Adreno 642. As usual, Qualcomm doesn’t disclose a lot of design details here, but they do reveal a generational performance increase of up to + 50% per compared to the Snapdragon 768G, which means on the 765G which should increase to + 72%. Based on our past benchmarks, this should result in performance similar to the Adreno 640 from the flagship Snapdragon 855 from a few years ago – meaning the GPU is apparently aptly named when it comes to performance.
Qualcomm uses its latest Scalar + Tensor + Vector merged DSP and AI engine in the new Snapdragon 780G, which means it should be matched in architectural design as a new unit on the Snapdragon 888, albeit at lower levels. lower performance levels. Qualcomm announces TOP 12 performance of AI on all SoC IP blocks, which is more than 2 times that of the predecessor.
In terms of DRAM, the SoC remains a 2x16b LPDDR4X-2133 design, which appears to be crucial for cost reduction in this market segment.
A very big capacity upgrade is found from the camera ISPs. Again, just like the DSP, the new design follows the new IP architecture similar to that used in the Snapdragon 888, using a new Spectra 570 triple block capable of running three RGB camera sensors simultaneously. 192MP captures are possible for single modules (with shutter lag), or in terms of running without shutter lag, we can see 1x 84MP, 64 + 20MP, or 3x 25MP sensor configurations. In terms of video encoding, we don’t see a mention of much change from the predecessor, so we assume that the video capture capabilities remain the same.
What’s very interesting about the new design and probably telling the whole market is the fact that the new part no longer advertises mmWave capability from its modem. The new X53 modem has apparently removed this feature from its datasheet. Generally, mmWave remains an extremely niche feature that is currently only widely deployed in certain US cities around the world. Given that SoCs target lower-priced devices and we saw some extremely inexpensive Snapdragon 765 phones last year, mmWave’s capabilities were likely at odds with the market segment these phones are targeting – vendors have always the possibility of using higher. end solutions such as the Snapdragon 870 if they wish to include mmWave connectivity.
Finally, the new SoC is made on Samsung’s 5LPE process node, which is an upgrade from last year’s Snapdragon 765’s 7LPP node, although the node doesn’t look as promising compared to node 5 nm from TSMC, it is used in a The SoC in this price category is definitely positive and should show noticeable gains over its predecessor.
Qualcomm plans to pair the Snapdragon 780G SoC with FastConnect 6900 Wi-Fi chips with 6E Wi-Fi connectivity, hopefully signaling the adoption of new 6 GHz spectrum technology.
The Snapdragon 780G is expected to roll out to commercial devices in the second quarter of 2021.
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