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As expected, Huawei has officially unveiled its latest flagship processor, the HiSilicon Kirin 990, at IFA 2019 in Berlin, which still relies on a 7nm manufacturing technology, although it has improved Energy efficiency. The processor is manufactured by TSMC using FinFET Plus EUV 7nm technology, the same manufacturing technology used to manufacture the Apple A13 processor from Apple.
Huawei is proud of the many peculiarities of mobile communications. Although Samsung has already announced the Exynos 980 processor, featuring a built-in 5G modem, HiSilicon Kirin 990 is expected to be the first 5G compatible processor to hit the market. The HiSilicon Kirin 990 processor will also come with an integrated 5G modem, which guarantees high power consumption and less RAM. Moreover, it is the first processor with more than 10.3 billion transistors.
The new HiSilicon Kirin 990 is more powerful and smaller, it is supposed to be 26% smaller than the Qualcomm Snapdragon 855 and 36% smaller than the Samsung Exynos 9820. In fact, it has eight cores in total, two cores for the Cortex-A76 complex tasks at 2.86 GHz and two Cortex-A76 cores with 2.36 GHz, plus four cores for a 1.95 GHz Cortex-A55 less complex.
In addition, the 7nm + EUV manufacturing technology has allowed Huawei to improve the energy efficiency of the HiSilicon Kirin 990 processor. Compared to the Snapdragon 855, the new HiSilicon Kirin 990 is 12% more efficient, its average efficiency is 35% and its efficiency 15%.
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