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TSMC with EUV process preparing for an AI arrow, 5G
Monica Chen, Hsinchu; Jessie Shen, DIGITIMES
The chip makers are expected to introduce their next-generation chip solutions for AI and 5G applications at the upcoming Mobile World Congress (MWC) trade show, with the Taiwan Semiconductor Manufacturing Company (TSMC) being their primary foundry partner, thanks to the competitiveness of its processing technology, according to industry sources.
Huawei's HiSilicon, Qualcomm, Intel, MediaTek and Broadcom are all looking to align their new products for mobile handsets and base stations, as well as other applications based on AI and 5G technologies, at the upcoming MWC 2019, which will begin on the 25th. February.
Qualcomm will showcase its flagship product, the Snapdragon 855 Mobile SoC, which will be used in a number of new 5G smartphones scheduled for launch this year. Qualcomm will also present its Snapdragon X55 5G modem at the Barcelona trade show. Both smart solutions would be fabricated using TSMC's FinFET 7 nm processing technology.
Huawei is expected to introduce its new Balong 5000 series smartphone equipped with the 5G baseband developed by HiSilicon at the show next week, while the MediaTek range will include its Helio M70 and other 5G chip solutions, have indicated these sources. HiSilicon and MediaTek have partnered with TSMC to manufacture their advanced 7nm products, the sources said.
Meanwhile, the 5G models presented by major smartphone vendors at the event will also highlight the 7nm SoCs currently available to power devices, with TSMC being the leading manufacturer of these chip developers, the sources said.
In addition, TSMC has obtained 7-nm chip orders for 5G-related applications, including HPC and IoT from AMD, Nvidia, Xilinx, NXP, OmniVision, and TI, the sources added. TSMC is expected to secure Apple's first order of 5-nm chips for iPhones 2020, sources said.
TSMC had previously expressed optimism about its performance in 2020 and 2021, when 5G and other emerging technologies would mature. Despite its gloomy economic and industrial outlook this year, TSMC said it is making progress in the development of less than 7nm processing technologies and plans to move to volume production of a new 5nm EUV treatment process. by 2020.
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