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It has already been confirmed that the Meizu 16 and Meizu 16 Plus smartphones will be launched on August 8th. In recent months, we have a good idea of what smartphones will have to offer, thanks to the founder of the company. Jack Wong. Now, however, it is the senior vice president of Meizu, Li Nan, who posted images of smartphone rendering on Weibo. In addition to this, both smartphones also appeared on TENAA further confirming the previously suggested specifications.
The rendering by Nan confirms only what we knew before. Smartphones are configured to carry a large screen wrapped around thin frames without a notch. The back panel of smartphones features a metal frame and a curved glbad liner. One of the images also confirms the fingerprint sensor inside the screen and the dual rear camera configuration presented on the Meizu 16 Plus.
The TENAA list, meanwhile, reveals that the Meizu 16 has a 6-inch screen and a battery of 2.950mAh. It bears a model number of MBB2Q. Previous rumors have suggested the device to Snapdragon 710 SoC sports, and 6GB of RAM. The Meizu 16 Plus should come with Snapdragon 845 SoC, and 8GB of RAM. The TENNA list mentions it as the M892Q and confirms it with a 6.5 inch screen and a 3570 mAh battery.
Both smartphones will also run under the Android operating system, but it will not be specified whether it will be Android Nougat or Android Oreo.
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While the dual rear-facing cameras and the on-screen fingerprint sensor are somewhat confirmed, Wong also mentioned the camera to come with other high-end features such as 3D touch support Heat dissipation system We will have to wait until August 8 to find out if Meizu plans to incorporate these features or if he decides to abandon them [19659009] You may be interested
Android operating system
SoC octa-core Qualcomm Snapdragon 845
Triple 12MP + 12MP cameras + 20MP
