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Qualcomm is secretly working on Sanpdragon 1000 SoC for Windows 10 Desktops providing high performance with low power draw.
Qualcomm has already established a niche presence in the field of chipsets recognized in the mobile industry. However, Qualcomm is currently aiming to compete with chipset giants such as AMD and Intel through the development of a Snapdragon 1000 series specifically designed for PCs.
Qualcomm unveiled a line-up of "always connected PCs" equipped with the Snapdragon 835 processor and Windows 10 last December. According to a report facilitated by WinFuture, the range of "Always-Connected PCs" is ready for launch in the last part of the year with modifications to accommodate the recently unveiled Snapdragon 850 chipset. The report added that the Snapdragon 1000 chipset with the code name SDM1000 would be able to facilitate processing power at the same level as an Intel U-series or Y-series chipset.
It is also essential to note that the TDP in the case of the SDM1000 is about 12 W, placing it in the ranks of the U and Y series Intel chipsets characterized by ultra low power. TDP (Thermal Design Power) could be defined as the maximum amount of heat that could be developed by a chip in actual use. It is imperative to observe a larger capacity of a processor in case of higher TDP.
However, concerns about SDM1000 compatibility with Intel processors in terms of bandwidth, raw performance, and flexibility are deep despite the similarities in the TDP. On the contrary, the architecture of the SDM1000 could be considered very efficient compared to that of Intel chips by providing almost twice or three times the life of the battery. Therefore, there is no problem for compromises as long as the SDM1000 is suitable for regular use.
The report also informed about the Snapdragon 1000 developer platform having two 128GB UFS 2.1-rated memory modules and 16GB of LPDDR4X RAM on board. The SDM1000 would also include the Snapdragon 850 software modem, Gigabit WLAN support, and a new power management chip for managing increased power usage.
See also: Qualcomm asks the ITC to ban the Intel-based iPhone in the United States.
According to the report, the Snapdragon 1000 is designed as a "socketed" chip that implies that the SoC would not be soldered to the motherboard thus suggesting the chip exchange. The dimensions of the SDM1000 are 20 x 15 mm, which is higher than the Snapdragon 850 but smaller than the average Intel processor which measures 45 x 24 mm in terms of dimensions.
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