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Qualcomm, which has more or less dominated the chipset industry in mobiles with its Snapdragon range, will gain the upper hand over Intel and AMD by manufacturing a new chip in the Snapdragon 1000 series exclusively for PC.
Image Credit: HMD Global, Nokia
Last year in December, Qualcomm unveiled the range of & # 39; PC always connected & # 39;, which were powered by the Snapdragon 835 processor and running on the modified Windows 10 S. report by WinFuture, these PCs are ready to release later this year and will be modified to adapt to the recently announced Snapdragon 850 chipset.
However, the Snapdragon 1000 chipset (codenamed SDM1000) is expected to provide as much processing power as an Intel Y-Series or U-Series chipset, according to the report.
WinFuture also notes that the SDM1000's TDP is of the order of 12 W, which places it within reach of ultra-low power Intel and Y power chips. For reference, the 12-inch MacBook Apple uses a Intel Y-series processor and other Ultrabooks use U-series chips.
TDP or Thermal Design Power is a unit that defines the maximum heat generated by a chip in actual use. In general, the higher the TDP, the more capable the processor is. The chips of the Y and U series of Intel are capable of 15 W.
Despite the corresponding TDP, it is unlikely that the SDM1000 will match Intel processors for flexibility, bandwidth, and raw performance yet. On the other hand, the architecture could be much more efficient than Intel chips, offering 2-3 times the battery life. As long as the chip is powerful enough for regular use, the compromise should not matter.
In other words, Intel really needs to start worrying.
Obviously, the SDM1000 will also be specifically targeted at small, space-saving notebooks. Indeed, the Taiwanese electronics giant ASUS, which has partnered with Qualcomm to unveil the NovaGO "Always Connected" PC in December, would be working on a device with the code name "Primus", which will use the SDM1000 in its reference design. . The device has not yet scheduled release date, but we should learn more about it soon enough.
The report states that the Snapdragon 1000 developer platform has 16GB of LPDDR4X RAM and two 128GB UFS 2.1 memory modules. There also seems to be support for Gigabit WLAN, the Snapdragon 850 software modem and also a new power management chip to handle increased power consumption.
In addition, the report states that the Snapdragon 1000 will be a "socket" chip, which means that the SoC will not be soldered to the motherboard, which could mean that the chip can be swapped.
The SDM1000 will have dimensions of 20 x 15 millimeters, which is larger than the Snapdragon 850 which has dimensions of 12.4 x 12.4 mm. However, it's even smaller than an average Intel processor that has dimensions of 45 x 24 mm.
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