Foveros 3D: Intel Announces Modular Technology for CPU Computing

On Wednesday 12/12, during the day of architecture, Intel introduced a new CPU composition technology, called Foveros 3D, which consists of a modular approach in which the processor will be badembled with multiple components individual (chiplets) and stackable. The idea, with Foveros, is to offer a custom chip for each device type, where the chips (cache, cache, chips, additional processor chips, AI chips) can be mounted on top of each other, defining the processing capacity and actual consumption of the final set. In addition to facilitating the badembly of processors for different purposes, the technology could help Intel overcome the 14 nm barrier, because Foveros will be a chip at 10 nm but may contain chips of 10, 14 and 22 nm [ Grâce à la possibilité d'intégrer les chiplets Core et Atom fonctionnant ensemble, le nouveau CPU pourra rivaliser avec les solutions présentées par Qualcomm pour les ordinateurs portables et les tablettes avec […] Windows 10. "Great colors" (Core) offer better performance for heavy activities, while "small colors" (Atom) are triggered for lighter tasks and when the device goes into sleep mode. The goal is to optimize the performance of a device whose battery can last a full day of use or a month in standby.

New microarchitectures

During the event, Intel announced that its new microarchitecture, Sunny Cove, was to debut on the new Xeon and Core processors, which will be released in the second half of 2019, under lithography 10 nm, and featuring single-threaded performance improvements, new instructions, and "scalability." "

The company's roadmap also mentions the Willow Cove microarchitecture, which is scheduled to launch in 2020 and 10 nm, and by 2021 the company has badumed that the first processors will be launched at 7 nm. the code name Golden Cove.

GPU confirmed for 2020

We also had the participation of Intel's senior vice president of architecture and graphics solutions, Raja Koduri., announcing the Gen11 new integrated chips, "designed to break the barrier of 1 TFLOPS." These chips will integrate the new Intel Core processor, based on 10-nm technology, has confirmed Intel's intention to launch dedicated video cards in 2020. According to him, the progress of the microarchitecture over the next 10 years will be greater than those of the last 50 years.

Which devices will use Foveros

Foveros and Sunny Cove are, in pri ncipe, two different technologies that can complement each other. Verge's team asked Intel which specific devices would use the new modular processor approach, but the company responded only by saying that from the second half of 2019, (mobile devices at the center of data) can rely on Foveros processors.