[ad_1]
Intel unveiled today a new technology, called Foverus that will allow 3D design of processing chips. This means that computer and / or graphics processing units can be " stacked " together.
Slides show AMD X570 with PCIe 4.0 at Computex and Intel Glacier Falls in the third quarter of 2019
The "stacking" technologies of chips are already well known, especially in the development of memory solutions, but the possibility of taking this for logic chips can mean a breakthrough for beating Moore's Law. The company says it will be possible to use Foverus to create smaller chiplets and plans to launch the first product using the technology logo in the middle of next year (2019) . Intel does not enter the product details, but says that it will be a computing element manufactured in 10 nm on a matrix typically used in low-power devices.
Intel has not specified in which type of end product it intends to implement components created with Foverus, but it is the type of technology that will primarily benefit the more compact systems, such as laptops.
[ad_2]
Source link
