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TSMC, one of the world's largest chip makers, has announced that it will begin producing a 3-nm mobile chipset by 2020. The company's first plant capable of building this type of component will start to be deployed in 2019.
Ready facilities, the company still has to wait a year to perfect the production of these components, to do the test and the preparation of mbad production. With this, it is only in 2021 that the company can be really ready to start making a Snapdragon for Qualcomm or A for Apple.
This means that, until 2022, the year of the bicentennial of Brazil's independence, we will already be able to see the first high-end smartphones with 3 nm chips on the market. Before that, however, TSMC and its competitors (including Samsung and Huawei) must first upgrade the 5nm smartphone chipset.
And the 7 nm?
Since the second half of this year, we are using 7nn chips on high-end smartphones, but 2019 will be the first year this standard should dominate the industry. Indeed, Qualcomm has finally managed to put its Snapdragon 855 on the market and, from January, the first smartphones equipped with this chip will reach consumers. Until then, the chips of the company were at the scale of 10 nm.
US $ 19 billion will be spent until the mbad production of these chips begins
To reach 3 nm, TSCM reports that will invest heavily in this new technology. 19 billion US dollars will be spent until the mbad production of these chips begins. In addition, the new scale will likely require chip developers (Qualcomm, MediaTek, Apple, etc.) to abandon the FinFET architecture and develop another standard.
Samsung and Huawei develop their mobile chipsets. rely on their own manufacturing structures. Samsung is even the world's largest in this market, but has not yet been able to abandon Qualcomm's chips on many of its cell phones.
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